Burnaby, BC – Enigma Interconnect Corp. has installed a Lenz optical drill/rout at its Burnaby plant. The machine was commissioned in July 2026 as part of our 2026–2027 technology roadmap.
The Lenz is a single-station, dual-spindle system with optical vision. Instead of relying only on the machine's own coordinates, the vision system checks where features actually sit on each panel, so holes and routed edges land where your design puts them.
What it adds to our capabilities
- Optical vision drilling down to 5.9 mil (0.15 mm)
- Mechanical blind microvia drilling
- Optical routing
- Controlled-depth milling and drilling
Why it matters for your designs
Smaller holes free up room for routing on dense boards. Blind microvias connect an outer layer to the layer beneath it without passing through the whole board, which opens the door to HDI designs. Controlled-depth milling and drilling let us build features such as cavities and back-drilled stubs to a set depth.
The Lenz is one step in a larger HDI plan. A microvia plating tank for automated copper fill of blind vias is scheduled for spring 2027, followed by laser drilling for laser-drilled blind vias and stacked microvias in summer 2027. See the full timeline on our equipment page.
Planning a fine-pitch or HDI build? Send us your files and we'll match your design to our current capabilities and roadmap.