Burnaby, BC – Enigma Interconnect Corp. has installed a DIS multilayer welding system at its Burnaby plant, the latest step in our 2026–2027 technology roadmap.
Before a multilayer board is laminated, its inner-layer cores and prepreg are stacked and aligned. The DIS system welds those layers together, so the stack can't shift as heat and pressure are applied in the press.
What it adds
- Inner layers welded together before multilayer lamination
- Greatly reduced layer movement during the lamination cycle
- More consistent layer-to-layer registration
Why it matters for your designs
Layer movement during lamination is one of the main limits on how tightly features on different layers can line up. Holding the stack firmly in place keeps drilled holes centred on their inner-layer pads and gives more consistent results from panel to panel.
It is especially important for sequential lamination, where a board goes through the press more than once and every cycle is another chance for layers to move. With the DIS welder in place, we can take on more sequential lamination builds, such as boards with blind and buried vias.
It is also groundwork for build-up (HDI) technology. Together with the Lenz optical drill/rout installed in July, the microvia plating tank scheduled for spring 2027 and laser drilling planned for summer 2027, it moves us toward building stacked-microvia boards in Burnaby. See the full timeline on our equipment page.
Planning a sequential lamination or HDI design? Send us your files and we'll match your design to our current capabilities and roadmap.