Facility & Equipment

  • Facility

    • Manufacturing: 35,000 sq. ft.

    • Office space: 3,000 sq. ft.

  • Frontline - Insight

    • Expedite Design analysis and quoting

  • Maskless Direct Imaging

    • Direct Imaging Technology since 2013

    • Use for all circuit imaging and available for soldermask

    • Resolution down to 2 MIL trace and space

  • PAL Automated Pulse Plating

    • Installed in 2022

    • Pulse plating for aspect ratio up to 20:1

    • Heavy copper plating available

    • Microvia copper fill plating tank (planned Spring 2027)

    • Automated dosing for steady state process control

    • Semi-automated daily analysis using Metrohm Professional CVS 894

  • Pluritec Inspecta HPL S2 Plus X-Ray Drill and Router with Vision

    • Optimize drill position after lamination for multilayer boards

    • Control Depth Drill and Rout

    • Layer analysis for improved stack-up yields

  • Mass VHF 200 and Wise Cleverstar

    • Conductive or non-conductive Via fill in accordance with IPC 6012 Class 3

    • Controlled planarization to minimize surface variation after paste removal

  • IPS Strip - Etch - Strip

    • 2 MIL Trace and Space

    • 3 MIL Cores Handling

    • Automated dosing for steady state process control

  • IPS Deep Gold Line

    • Allows processing of selective hard gold on full production panel, not just gold fingers

  • Pluritec Ecospray

    • Spray solder mask application with conveyorized tack-dry

    • Flexible colours: Green, Blue, Black, Red, White, Purple, Orange, Transparent

    • Easily coat any thickness of board

  • Microcraft JetPrint Direct Legend Printer

    • Digital ident printing (white)

  • TC-120 Automated Oven

    • Conveyorized Oven for consistent curing of solder mask

  • IPS Electroless Nickel Immersion Gold (ENIG)

    • Semi-automated ENIG plating

Investing in Capability: 2026–2027 Technology Roadmap

We keep reinvesting in our Burnaby plant so we can build tighter, more complex boards in Canada.

Completed in 2026

  • Alternative oxide horizontal system (January): better handling of inner layers and less scrap.

  • Multilayer press refurbishment (February): more consistent lamination pressure and more predictable material movement.

  • Hyoki aluminum oxide scrubber (June): better surface preparation for all soldermask jobs.

  • Dry film cut sheet laminator (July): better yield and handling of inner and outer layers.

New imaging and drilling capability (2026)

  • Altix LED direct imager (May 2026): all soldermask direct imaged, soldermask dams down to 2 mil, and tighter copper-to-soldermask registration.

  • Lenz optical drill/rout (July 2026): single-station, dual-spindle optical vision drilling down to 5.9 mil (0.15 mm), mechanical blind microvia drilling, optical routing, and controlled-depth milling and drilling.

Coming next

  • Fall 2026 – DIS multilayer welding system: welds inner layers together to prevent movement during lamination.

  • Winter 2026 – IPS automated electroless copper line: higher throughput and higher aspect ratio capability.

  • Winter 2026 / Spring 2027 – Plasma etching and PTFE activation: hole preparation for PTFE and other advanced RF materials.

  • Spring 2027 – Microvia plating tank: automated copper fill of blind vias (up to 1:1 aspect ratio).

  • Summer 2027 – Laser drilling: laser-drilled blind vias and stacked microvias.

Planning an HDI, RF or high-reliability build? Talk to us early and we'll match your design to our capability timeline.